• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a semifinished product and a method for producing a semifinished product for a printed circuit board. The method comprises the following steps: forming an insulating layer (2) of an electrically insulating material, forming an outer lead layer (3; 4) of aluminum on the insulating layer (2), forming a through-hole through the insulating layer (2) and the conductive layer (3; 4), such that in the region of the passage opening (5) an opening region, which is assigned to the conductor layer (3; 4), and a further opening region, which is assigned to the insulating layer (2), prepare the opening region for a metallization by applying an activation layer (7) in the opening area, preparing the further opening area for a metallization by applying a further activation layer (10) in the further opening area, and metallizing the opening area and the further opening area by applying to the activating layer ( 7) in the opening area and the other A In the further opening region, in each case a metallization layer (11) of one or more electrically conductive materials is deposited.
    公开号:CH705020B1
    申请号:CH00563/12
    申请日:2012-04-25
    公开日:2016-03-31
    发明作者:Udo Bechtloff；Lutz Lange；Sven Uhlig
    申请人:Ksg Leiterplatten Gmbh；
    IPC主号:
    专利说明:

    The invention relates to technologies in the field of printed circuit boards.
    Background of the invention
    Circuit boards are used to accommodate electronic or electrical components. PCBs are known in single and multi-layered design. Multilayer printed circuit boards have several electrical conductor layers which are separated from one another by means of insulating layers.
    As a material for the conductor layers forming conductive layers copper is often used. Here, however, there is the problem that copper due to its natural material properties must first be treated on the surface side in order to enter into an adhesive connection with the electrically insulating material of the insulating layers in the subsequent compression of the conductor layers with the insulating layers.
    Document US 2005/0178669 describes a method of galvanizing aluminum surfaces for a subsequent coating.
    Summary of the invention
    The object of the invention is to provide a semifinished product for a single or multilayer printed circuit board and a method for manufacturing, with which the possibilities for individual design of printed circuit boards for various applications are extended. In particular, adhesion problems between layer materials should be avoided.
    This object is achieved by a method for producing a semifinished product for a single or multilayer guide plate according to the independent claim 1 and a semi-finished product according to the independent claim 9. Advantageous embodiments of the invention are the subject of dependent claims.
    The method for producing the semifinished product can be carried out as a method for producing a single-layer or multilayer printed circuit board, in particular by providing a step with which the external line layer is formed with printed conductor structures. As a result, a single or multilayer printed circuit board is then produced, which is based on the semi-finished product described and uses this as a kind of PCB base structure. The circuit board is formed with a via in the through hole.
    While a single-layer printed circuit board has only one conductor layer or plane, a multilayer printed circuit board has several such layers or planes.
    In the invention, it is provided that the outer conductor layer consists of aluminum. As a material, aluminum has the advantage that it optionally forms a well-adhering connection with materials which are usually used for insulating layers in printed circuit boards, for example resin materials such as epoxy, when the conductive layer and insulating layer are pressed together. In addition, aluminum has a lower weight compared to copper, which is often used in circuit boards. By means of the conductor layer of aluminum a direct bonding with aluminum wires is made possible.
    The step of "metallizing" as used herein refers to forming a solderable surface layer capable of bonding well with a solder material during soldering. The metallization of the opening region and of the further opening region can be carried out in a common step or in separate metallization steps. It can also be provided in one embodiment to provide the opening area on the one hand and the other opening area on the other hand to form the respective solderable surface with different electrically conductive materials.
    The preparation of the opening area on the one hand and the other opening area on the other hand is preferably carried out in separate steps. The preparation for the metallization corresponds to a kind of activation of the respective surface areas for the subsequent metallization, d. H. forming a solderable surface. Since the aluminum material is to be provided in the opening region and the material of the insulating layer is to be provided with an activation layer in the further opening region, it is preferably provided that the activation layers are produced from different materials which are respectively matched to the material in the opening region and in the further opening region.
    As the material for the insulating layer, any materials can be used, as they are commonly used for printed circuit board production. These include in particular resin materials such as epoxy.
    A preferred embodiment of the invention provides that the opening area is provided during preparation for the metallization by means of chemical nickel plating with a nickel-containing activation layer. Chemical nickel plating differs from galvanic plating in that no current flow is used for deposition. Material mixtures with a predominant nickel content can be used, for example a nickel-gold alloy. A material advantageously used for chemical nickel plating of the aluminum surface in the opening region is zinc.
    In an expedient embodiment of the invention can be provided that on the insulating layer, a further conductor layer made of aluminum, through which the passage opening extends, so that in the region of the passage opening, an additional opening portion is formed, which is associated with the further conductive layer , With the help of the further line layer, a further electrical line level is provided in the semifinished product. The additional opening areas thus created in the passage opening can be treated in terms of activating and metallizing as the opening areas associated with the line layer in the passage opening.
    An advantageous embodiment of the invention provides that the further conductive layer is produced as a further outer layer. In this way, a semifinished product for a printed circuit board is formed, in which a central insulating layer is covered on both sides by line levels and in which a through-connection is formed.
    Preferably, an alternative development of the invention provides that the further conductor layer is produced as an inner layer between the insulating layer and a further insulating layer. In this way, a semifinished product for a multilayer printed circuit board is formed, in which at least one line level is arranged lying inside between insulating layers.
    In an advantageous embodiment of the invention can be provided that the conductor layer and / or the further conductor layer are formed as a structured conductor layer made of aluminum with a conductor base structure. In contrast to the conductor layer with the conductor base structure may alternatively be provided that the conductor layer is formed unstructured, so that a kind of unstructured coating is formed on at least one of the flat outer sides of the insulating layer. Semi-finished products for multilayer printed circuit boards can combine structured and unstructured conductor layers.
    A further development of the invention can provide that printed conductor base structure is produced as a basic structure for the power electronics. In this case, the conductor tracks preferably have a thickness of at least 100 μm. Conductor thicknesses of up to 400 microns or even more can be provided. Alternatively, the strip conductor base structure may be designed as a thin-film structure.
    A preferred embodiment of the invention provides that is prepared on the line layer, a soldering area for metallization and the prepared soldering area is metallized by one or more electrically conductive materials are deposited in the prepared soldering area. The soldering area forms a solderable area on the outside surface of the conductor layer. The preparation and / or metallization of the soldering area can take place at the same time or with a time delay for preparing and / or metallizing the opening areas. For example, it may be provided to activate the soldering area in a method step together with the opening area, ie to form the activation layer. The subsequent metallization can also take place at the same time in one step for the opening area in the passage opening on the one hand and the soldering area on the conductive layer. Alternatively, however, separate steps are possible. With regard to the preparation and / or metallization, the explanations made in connection with the aluminum surfaces in the opening region of the passage opening apply correspondingly. Further solder regions may be provided on the further conductor layer, in particular if this is likewise formed outside.
    Description of preferred embodiments of the invention
    The invention is explained in more detail below with reference to embodiments with reference to figures of a drawing. Hereby show:<Tb> FIG. 1 <SEP> a schematic representation of a layer arrangement for a printed circuit board in which an insulating layer is coated on both sides with a conductive layer of aluminum,<Tb> FIG. 2 <SEP> is a schematic illustration of the layer arrangement from FIG. 1, wherein external surface areas of the line layers are provided with an activation layer which also extends into a passage opening,<Tb> FIG. 3 <SEP> is a schematic representation of the layer arrangement from FIG. 2, wherein a further activation layer is formed in the passage opening on an opening region which is formed by the insulating layer in the passage opening,<Tb> FIG. 4 is a schematic representation of the layer arrangement from FIG. 3, wherein a metallization is formed on the activation layer and the further activation layer,<Tb> FIG. FIG. 5 is a schematic illustration of a portion of a printed circuit board using the layer arrangement of FIGS. 4 and 5. FIG<Tb> FIG. 6 is a schematic representation of a layer arrangement for a printed circuit board, in which inner and outer conductor layers are formed from aluminum.
    Fig. 1 shows a schematic representation of a designed as a layer arrangement semifinished product 1 for a printed circuit board in cross section. It can be provided based on the semifinished product 1 to manufacture a printed circuit board, for example, a printed circuit board with additional interconnect structures. But also the semifinished product 1 shown can already be used as a printed circuit board.
    An insulating layer 2 is provided on the front and the back with a conductor layer 3 and a further conductor layer 4, each consisting of aluminum and are formed lying outside. The conductor layer 3 and the further conductor layer 4 may also be referred to as first and second conductor layers, respectively. The material for the insulating layer 2 is provided for example by means of so-called prepregs or in the form of a film material. The conductor layers 3, 4 made of aluminum can be produced by means of aluminum foils.
    It is shown a portion of the semifinished product 1, in which a passage opening 5 through the conductor layers 3, 4 and the insulating layer 2 is formed therethrough. The line layer 3 on the front side and / or the further line layer 4 on the rear side of the insulating layer 2 can be embodied as structured line layers with associated printed conductor structures.
    Fig. 2 shows a schematic representation of the layer arrangement of Fig. 1, wherein the outer surface regions 6 of the two line layers 3, 4 are provided with an activation layer 7. The activation layer 7 on the conductor layers 3, 4 also extends into the passage opening 5, namely into opening areas 8 formed there, which are formed in the passage opening 5 by the conductor layers 3, 4.
    Fig. 3 shows a schematic representation of the semifinished product of Fig. 2, wherein in the passage opening 5 on an opening portion 9, which is formed by the insulating layer 2 in the through hole 5, a further activation layer 10 is prepared.
    The activation layer 7 on the aluminum surfaces of the conductive layers 3, 4 is produced by means of chemical nickel plating, for example in the form of a zincate coating. The further activation layer 10 is formed by means of a direct metallization process as a DMSE layer (in particular "direct metallization ethylenedioxythiophene") by means of a conductive organic polymer. Other materials can be used to activate the surface in the insulating layer 2 associated opening portion 9 in the through hole 5.
    Fig. 4 shows a schematic representation of the formed as a layer arrangement of semifinished product 1 of Fig. 3, wherein on the activation layer 7 and the further activation layer 10 now a metallization 11 is deposited, which consists for example of copper The deposition can be by means of a galvanic process be executed. In this way, solderable surface areas are formed, which serve for example for connection of electronic components.
    The layer structure produced can be used in this form as a printed circuit board. However, further processing steps may also be provided, in particular for the formation of a desired strip conductor structure. For this purpose, process steps of conventional printed circuit board technology can be used, including, in particular, photolithography, etching and coating with solder resist. Solderable or bondable surfaces can be produced, for example, by depositing nickel or silver deposits. For this purpose, the technologies known as such in connection with printed circuit board production can be used.
    Fig. 5 shows a schematic representation of a portion of a printed circuit board, which was prepared starting from the semifinished product 1 according to FIGS. 1 to 4. A conductor track structure having a soldering surface 20 and a bonding surface 21 is formed. The bonding surface 21 is made by etching away the metallization 11 and the activation layer 7. In addition, solder stop regions 22 are produced.
    Fig. 6 shows a schematic representation of a layer arrangement for a multilayer printed circuit board in which a plurality of insulating layers 30, 31, 32 are stacked on one another, which are produced by means of so-called prepregs or in the form of a film material. On the outside, the stack of insulating layers 30, 31, 32 on the front and the back is provided with a respective conductor layer 33, 34 made of aluminum. In the stack of the insulating layers 30, 31, 32, there are further formed conductive patterns 35 which are fabricated in the construction of the stack of insulating layers 30, 31, 32 by conventional technology using photolithography and etching. The semifinished product shown in FIG. 6 can now be further processed in the manner described above with reference to FIGS. 1 to 5, in order to form solderable or bondable surface regions in the region of the passage opening 5 and on the aluminum layers 33, 34.
    权利要求:
    Claims (9)
    [1]
    A method of manufacturing a semifinished product for a single or multilayer printed circuit board, the method comprising the following steps:Forming an insulating layer (2; 30, 31, 32) of an electrically insulating material,- Producing a first conductor layer (3; 33) made of aluminum on the insulating layer (2),- Forming a through hole (5) through the insulating layer (2) and the first conductor layer (3), such that in the region of the passage opening (5) an opening portion (8) which is associated with the first conductor layer (3), and a further opening area (9) are formed, which is associated with the insulating layer (2),Preparing the opening area (8) for a metallization by applying an activation layer (7) in the opening area (8),Preparing the further opening area (9) for a metallization by applying a further activation layer (10) in the further opening area (9),Metallizing the opening area (8) and the further opening area (9), in each case by a metallization layer (11) of one or more on the activation layer (7) in the opening area (8) and the further activation layer (10) in the further opening area (9) electrically conductive materials is deposited, and- structuring the first conductor layer (3; 33) as a structured conductor layer made of aluminum with a conductor base structure having a bonding surface (21), wherein in the region of the bonding surface (21) the activation layer (7) and the metallization layer (11) are removed.
    [2]
    2. The method according to claim 1, characterized in that the opening region (8) is provided during preparation for the metallization by means of chemical nickel plating with a nickel-containing activation layer.
    [3]
    3. The method according to claim 1 or 2, characterized in that on the insulating layer (2) a second conductor layer (4; 34) is made of aluminum, through which the passage opening (5) extends, so that in the region of the passage opening (5 ) an additional opening area is formed, which is associated with the second conductive layer (4, 34).
    [4]
    4. The method according to claim 3, characterized in that the second conductor layer (4; 34) is produced as a further outer layer.
    [5]
    The method according to claim 3, characterized in that said insulating layer has a plurality of insulating layers (30, 31, 32) and the second conductive layer is formed as an inner layer (35) between the plurality of insulating layers.
    [6]
    6. The method according to any one of claims 3 to 5, characterized in that the second conductor layer (4; 34) is formed as a structured conductor layer made of aluminum with a conductor base structure.
    [7]
    7. The method according to claim 6, characterized in that the conductor track base structure is produced as a base structure for power electronics.
    [8]
    8. The method according to any one of the preceding claims 1 to 7, characterized in that on the first and / or the second conductor layer (3; 4) prepares a soldering region (20) for metallization and the prepared soldering area is metallized by in the prepared Soldering one or more electrically conductive materials are deposited.
    [9]
    9. Semi-finished product for a single-layer or multi-layer printed circuit board, comprising:An insulating layer (2; 30, 31, 32) made of an electrically insulating material,- A first and / or a second conductor layer (3; 4) of aluminum on the insulating layer (2; 30; 32) andA passage opening (5) through the insulating layer (2; 30, 31, 32) and the first and / or the second line layer (3; 4) such that an opening region (8) in the region of the passage opening (5) which is assigned to one of the first and / or the second conductive layer (3; 4) and a further opening region (9), which is assigned to the insulating layer (2),wherein the passage opening (5) in the opening area (8) and in the further opening area (9) is metallized by a respective activation layer (7) in the opening area (8) and in the further opening area (9) each have a metallization layer (7, 10) one or more electrically conductive materials is deposited, and wherein the first and / or the second conductor layer (3; 4; 33; 34) is formed as a structured conductor layer made of aluminum with a conductor base structure having a bonding surface (21) in the region of which Activation layer (7) and the metallization layer (11) are removed.
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    同族专利:
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    AT511758B1|2014-03-15|
    DE102011050424B4|2017-09-28|
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    AT511758A3|2013-12-15|
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    DE102011050424A1|2012-11-22|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US3462832A|1966-10-24|1969-08-26|Gen Dynamics Corp|Process for fabricating high density multilayer electrical interconnections|
    DE3012889C2|1979-04-30|1984-01-12|Kollmorgen Technologies Corp., 75201 Dallas, Tex.|Base material for the manufacture of printed circuits|
    JPS5933894A|1982-08-19|1984-02-23|Denki Kagaku Kogyo Kk|Method of producing hybrid integrated circuit board|
    EP0180220B1|1984-11-02|1992-09-02|AMP-AKZO CORPORATION |A process for producing metal clad thermoplastic base materials|
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    US6630743B2|2001-02-27|2003-10-07|International Business Machines Corporation|Copper plated PTH barrels and methods for fabricating|
    CN1922340A|2004-02-17|2007-02-28|泰科印刷电路集团有限公司|Method of electroplating on aluminum|
    US7601419B2|2005-12-19|2009-10-13|Samsung Electro-Mechanics Co., Ltd.|Printed circuit board and method of manufacturing the same|AT515069B1|2013-11-07|2019-10-15|At & S Austria Tech & Systemtechnik Ag|Printed circuit board structure|
    法律状态:
    2019-05-31| PFA| Name/firm changed|Owner name: KSG GMBH, DE Free format text: FORMER OWNER: KSG LEITERPLATTEN GMBH, DE |
    优先权:
    申请号 | 申请日 | 专利标题
    DE102011050424.9A|DE102011050424B4|2011-05-17|2011-05-17|Method for producing a semifinished product for a single-layer or multi-layer printed circuit board|
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